Precision with no burr, no stress, no compromise.
Photochemical etching is a chemical machining process for thin metal, where the shape is formed by controlled etching — with no pressure, no heat and no tooling. The material retains its full properties and the edges are perfectly clean.
Meshes · masks · shields · microchannels
What stamping, laser and waterjet cannot do.
In etching the whole part is formed at once, regardless of how complex the shape is. Intricate geometry adds no cost, and the absence of mechanical and thermal forces means a perfectly flat part, free of micro-cracks.
Burr-free edges
Smooth, clean edges straight out of the process — no deburring or finishing.
No stress or heat
No heat-affected zone and no deformation. The material keeps its structure and full properties.
Complexity for free
Hundreds of holes and micro-details cost the same as a simple shape — in a single cycle.
No tooling cost
The tool is a photomask, not an expensive die. A design change is a new file, not new tooling.
Thin & micro details
Parts from about 0.01 mm thick, with details unreachable for mechanical machining.
Prototype = production
The same process for 1 and 10,000 pieces. Fast prototype iteration with no change of technology.
Six steps from file to finished part.
Every stage is controlled and repeatable — the guarantee that the series looks identical to the approved prototype.
Send your design for a quote →Design & photomask
A precise mask (phototool) is produced from the CAD file, reproducing the part geometry.
Photoresist lamination
A cleaned metal sheet is coated with a light-sensitive protective layer.
UV exposure
The mask transfers the pattern to the resist — only what is to remain metal is hardened.
Developing
The uncured resist is removed, exposing the areas to be etched.
Etching
An etchant spray removes the exposed metal, forming the final shape from both sides.
Resist strip & inspection
Parts are cleaned, measured and inspected before shipping.
Where the micron and repeatability matter.
Meshes & filters
Precision meshes, sieves and apertures with controlled open area and repeatable aperture.
EMI / RFI shields
Shields and apertures for suppressing electromagnetic interference in electronics.
Springs & flexures
Flat springs, contacts, compliant joints and parts with precise elasticity.
SMT stencils & masks
Solder-paste stencils and technological masks with sharp, clean edges.
Washers, shims, contacts
Precision spacers, contacts and lead-frame parts for electronics.
Microfluidics
Channels, apertures and components for microfluidic and laboratory systems.
| Material thickness | approx. 0.01 – 2.0 mm |
|---|---|
| Tolerance | typically ±10% of material thickness |
| Metals | stainless steel, spring steel, nickel & alloys, copper, brass, beryllium-copper, phosphor bronze, aluminium, titanium, molybdenum, kovar, mu-metal |
| Batch size | from 1 pc (prototype) to series production |
| Tooling | none — the tool is a photomask |
| Finishing | coatings and additional processing available on request |
Practically any technical metal.
Material and thickness depend on the application — from ultra-thin masks to structural parts. I'll advise what works best for your project.
- Industries: electronics, medical, aerospace, automotive, telecom.
- Design support — I'll help prepare the geometry for the process.
- Fast prototype, smooth transition to series with no change of technology.
Have a thin metal part in mind?
Send a file or a sketch — I'll assess feasibility and prepare an etching quote.